32GB G.Skill DDR3 PC3-17000 2133MHz TridentX Series CL9 (9-11-11-31) Quad Channel kit by G.Skill
- 1 review
- Item Number: 13687
- Part Number: F3-2133C9Q-32GTX
No longer available. See alternative options
Key Features
- 32GB G.Skill TridentX DDR3 Quad Channel kit (4x8GB modules)
- 2133MHz PC3-17000
- CL9 (full timings of 9-11-11-31) at 1.60V
- Engineered specifically for the Intel Z87/Z77 platforms
- With unique heatsinks with removable top fin, reducing height to only 39mm
See product description
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32GB G.Skill DDR3 PC3-19200 2400MHz TridentX Series CL10 (10-12-12-31) Quad Channel kit
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Details
32GB G.Skill TridentX Quad Channel kit, designed especially for the Intel Z87 and Z77 platforms. DDR3 2133MHz memory kit, PC3-17000, with memory timings of CL9 (9-11-11-31) at 1.60V.
With Intel XPM (Extreme Memory Profile) and equipped with the brand new G.Skill TridentX heatsinks. Features a unique removable top fin reducing height from 54mm to 39mm.
This 32GB quad channel memory kit consists of 4 matched 8GB DDR3 memory modules.
It’s Not The Fastest, Until It’s TridentX!
Currently holding the fastest DDR3 speed world record at a staggering 4404MHz, G.SKILL TridentX series is known as the world’s most powerful and fastest DDR3 memory available in the market with numerous world record titles under its belt. Named after the powerful weapon of Poseidon, Greek God of the Seas, G.SKILL TridentX is imbued with extreme overclocking capabilities waiting to be unleashed in your system.
Pre-tested by G.Skill in a wide range of motherboards for best compatibility. Please refer to the current QVL on the G.Skill website here.
With Intel XPM (Extreme Memory Profile) and equipped with the brand new G.Skill TridentX heatsinks. Features a unique removable top fin reducing height from 54mm to 39mm.
This 32GB quad channel memory kit consists of 4 matched 8GB DDR3 memory modules.
It’s Not The Fastest, Until It’s TridentX!
Currently holding the fastest DDR3 speed world record at a staggering 4404MHz, G.SKILL TridentX series is known as the world’s most powerful and fastest DDR3 memory available in the market with numerous world record titles under its belt. Named after the powerful weapon of Poseidon, Greek God of the Seas, G.SKILL TridentX is imbued with extreme overclocking capabilities waiting to be unleashed in your system.
Pre-tested by G.Skill in a wide range of motherboards for best compatibility. Please refer to the current QVL on the G.Skill website here.
Specifications
| CAPACITY | 32GB |
| MEMORY SPEED | 2133MHz (DDR3-2133) |
| STANDARD | PC3-17000 |
| SINGLE MODULE OR DUAL KIT | Quad channel kit |
| CAS LATENCY | CL9 |
| MEMORY TIMINGS | 9-11-11-31 |
| VOLTAGE | 1.60V |
| ERROR CHECKING | Non-ECC |
| FEATURES | TridentX heatsinks with removable top fin Intel XMP ready Engineered for Intel Z87/Z77 platforms |
| REGISTERED | Unbuffered |
| TECHNOLOGY | 240-pin DDR3 SDRAM memory upgrade kit |
| CONFIGURATION | Double-sided 8GB modules, four modules per kit |
| PACKAGING | Retail packaging |
| WARRANTY | Lifetime manufacturers warranty |
User Reviews
- 1 review
Michael O'Toole
G-Skill 32GB Kit
March 7th 2017 Verified user
The ram performs well however I did have one issue...
The heat sinks one of the sticks was misaligned to such a degree I could not insert it into the ram slots on my motherboard... I has two choices, I could take off the heat-sink and realign it or or return the memory modules...
I choose to re-seat the heat-sink but you should be aware that doing so may result in weakening the bond and possibly reducing the heat-sink efficiency...
On this occasion the the heat-sink fell after some time and landed on my graphics card, luckily enough it didn't short out the board.
I added an elastic band to prevent this in future but this is not entirely satisfactory, the heat-sink should have been aligned correctly to begin with. This begs the question, how could a poorly aligned heat-sink get passed Q&A in manufacturing...
The heat sinks one of the sticks was misaligned to such a degree I could not insert it into the ram slots on my motherboard... I has two choices, I could take off the heat-sink and realign it or or return the memory modules...
I choose to re-seat the heat-sink but you should be aware that doing so may result in weakening the bond and possibly reducing the heat-sink efficiency...
On this occasion the the heat-sink fell after some time and landed on my graphics card, luckily enough it didn't short out the board.
I added an elastic band to prevent this in future but this is not entirely satisfactory, the heat-sink should have been aligned correctly to begin with. This begs the question, how could a poorly aligned heat-sink get passed Q&A in manufacturing...
Review of 32GB G.Skill DDR3 PC3-17000 2133MHz TridentX Series CL9 (9-11-11-31) Quad Channel kit
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