Thermal Grizzly Kryonaut heat sink compound 12.5 W/m·K 37 g by Thermal Grizzly
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- Item Number: FD694878
- Part Number: TG-K-100-R
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Expected to ship within 11 days of order Shipping within Ireland only € 4.99 -or spend €100.00 to get free shipping |
Key Features
- 12.5 W/m·K
- 3.7 g/cm³
- Constitutive ingredients: Silicone
See product description
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Details
Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.
- designed for Overclocking
- excellent thermal conductivity
- no curing
- long-term durability
- no electrical conductivity!!!
- applicable with aluminum (warning is for Conductonaut only!)
„Kryo" - the greek word for "cold" - also found in the german word for "cryoengineering", suggests that this thermal grease was created especially for cryogenic applications - for the true "Kryonauts" amongst the "extreme overclockers".
Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus guaranteeing remarkable heat transfer.
- designed for Overclocking
- excellent thermal conductivity
- no curing
- long-term durability
- no electrical conductivity!!!
- applicable with aluminum (warning is for Conductonaut only!)
„Kryo" - the greek word for "cold" - also found in the german word for "cryoengineering", suggests that this thermal grease was created especially for cryogenic applications - for the true "Kryonauts" amongst the "extreme overclockers".
Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus guaranteeing remarkable heat transfer.
Specifications
| WEIGHT / VOLUME | 37 g |
| THERMAL CONDUCTIVITY | 12.5 W/m·K |
| OPERATING TEMPERATURE | -250 - 350 °C |
| DENSITY | 3.7 g/cm³ |