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Thermal Grizzly Hydronaut heat sink compound Thermal paste 11.8 W/m·K 1 g by Thermal Grizzly


Thermal Grizzly Hydronaut heat sink compound Thermal paste 11.8 W/m·K 1 g Image

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Key Features

  • Thermal Grizzly Hydronaut, Thermal paste, 11.8 W/m·K, 2.6 g/cm³, -200 - 350 °C, 1 g
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Details
Hydronaut can be used for overclocking due to it's excellent thermal conductivity, but it was created specifically for users with larger-scale cooling solutions, who are looking for a quality product with an excellent price-performance ratio, for example for their water cooling system.

- suited for Overclocking
- excellent thermal conductivity
- no curing
- silicone-free
- no electrical conductivity
- applicable with aluminum (warning is for Conductonaut only!)

The Hydronaut thermal grease delivers optimal heat transfer capabilities for larger-scale cooling solutions like water cooling systems.

Hydronaut thermal grease consists of a silicon-free structure. The makes it very light and highly flexible and easy to apply.

Hydronaut achieves best results if used on medium- to large-scale cooling solutions. This product is ROHS-compliant for demanding users.
Specifications
WEIGHT / VOLUME 1 g
THERMAL CONDUCTIVITY 11.8 W/m·K
OPERATING TEMPERATURE -200 - 350 °C
DENSITY 2.6 g/cm³
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