Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K by Cooler Master
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- Item Number: FD3611481
- Part Number: HTK-002-U1-GP
| 1 IN STOCK (1 local - 0 remote) |
€3.53 (incl. VAT)
|
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Key Features
- Suitable for CPU, chipsets on Mainboard, VGA card, etc
- Easy to use
- Zif Socket Templates ensure correct applying area with various CPU socket types
- Produces an even layer when using applicator
- Dielectric
- Wide range of application temperature
See product description
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Details
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Specifications
| THERMAL CONDUCTIVITY | 4.5 W/m·K |
| COLOR | White |