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Zalman STC8 Thermal Paste Compound 1.5g by Zalman


Zalman STC8 Thermal Paste Compound 1.5g Image

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Key Features

  • 1.5g thermal paste, delivered in easy-to-apply syringe
  • Excellent thermal conductivity
  • Micro-filler density
  • Easy to use, apply and store
  • Great cooling option for CPUs, graphics processors and more
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Details

Zalman's STC8 is a high-end thermal compound, designed to help keep CPUs, graphics processors and other components cool under pressure.

STC 8 thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity: 8.3 W/m-k. Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
Particle size technology provides optimal filler density to conveniently use on any type of computer chips. 350-480 Pa.s.
Syringe style is easy to use and rubber-cap prevents liquid content from being hardened over a period of time if reusing is needed
Fine micro particles fill up space between the heatsink and CPU to maximize cooling performance & RoHS Certified

 

Specifications
WEIGHT / VOLUME 1.5g
THERMAL CONDUCTIVITY 8.3 W/m·K
OPERATING TEMPERATURE -40 - 200 °C
COLOR Grey
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